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Amphenol LTW Encapsulation Technology
Taipei, Taiwan (July 20, 2011) –-Amphenol LTW Technology introduce customized PCB encapsulation technology via low pressure injection molding (LPIM) with shorten lead time. IP67 & IP68 with better mating seal to prevent sensitive electronic components from damaging.
For further information, please contact:
Sales & Marketing Department

Amphenol LTW Technology Co., Ltd.
E-mail: sales＠ltw-tech.com
URL: www.amphenolltw.com